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IC Diamond 24 Carat Diamond Thermal Compound 4.8 grams
Unmatched Thermal Performance and Reliability
Also Available in "7 Carat" size - 1.5 Grams
IC Diamond 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver. Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Key Features
Each tube of IC Diamond Thermal grease contains 24 carats of micronized diamond with diamond particle loadings @ 92% by weight, 94% after 10 minute dry-out prior to heat sink installation. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
Superior Thermal Performance
High Reliability
Exceptional Durability
IC Diamond is the ideal solution for system integrators, overclockers, system and white box builders.
Independent User Thermal Testing
702 Independent users in 20 different forums used their own PCs to test the difference between IC Diamond and other thermal compounds. This independent testing shows an average performance gain of 3.74 ºC over other thermal compounds
Application
IC Diamond is composed mostly of diamond powder (92%), and as such is quite thick. This high viscosity is by design for increased reliability and it is what makes our application procedure different.
Proper application is critical to optimum performance. Squeeze onto the center of the CPU an amount of IC Diamond compound about the size of a pea (5.0mm to 5.5mm) on the center of the CPU where most heat is concentrated. Place the heat sink on the CPU and press it down to spread IC Diamond over the CPU's surface, (Do not remove the sink to check the spread as it will introduce air into the joint). Clamp the heat sink and power up the PC. manufacturer instructions
Curing Time
IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use.
Stability
IC Diamond is designed for stability it will not bleed or separate in normal use.
Key Specifications
Thermal Conductance: 4.5 W/m-K
Thermal Resistance: 0.25oC-cm2/W@ 100 ì BLT
Average Particle Size: Compliancy: RoHS Compliant.
