CPU Socket Skylake LGA 1151, Haswell LGA1150 and LGA1155/1156
CPU Support LGA1155: Intel® Core™ i5-2000, i3-2000 Processor Series
LGA 1156: Intel® Core™ i3 Processor I3-530, I3-540; Core™ i5 Processor I5-650, 660, 670, 680; & Core™ i7-2600S; Pentium® Desktop Processor G6950
LGA 1150 up to TDP 73 Watts
Solution Mini-ITX form factor
Overall Dimension 82.6 x 81.0 x 27.8 mm
Material Copper Heatsink
Fan Dimension 75 x 75 x 15 mm
Speed At Duty Cycle 20%: 1000 RPM
At Duty Cycle 50%: 2500 RPM
At Duty Cycle 100%: 4000 RPM
Bearing 2 Ball Bearing
Rated Voltage 12 V
Power At Duty Cycle 20%: 0.6 W
At Duty Cycle 50%: 1.8 W
At Duty Cycle 100%: 4.8 W
Air Flow At Duty Cycle 20%: 6.0 CFM
At Duty Cycle 50%: 8.3 CFM
At Duty Cycle 100%: 11.9 CFM
Noise Level At Duty Cycle 20%: 21.0 dBA
At Duty Cycle 50%: 37.8 dBA
At Duty Cycle 100%: 44.0 dBA
Air Pressure At Duty Cycle 20%: 0.087 inch-H2O
At Duty Cycle 50%: 0.453 inch-H2O
At Duty Cycle 100%: 0.929 inch-H2O
Lead Wire Pin Out Pin1-Black (-)
Pin2-Yellow (+)
Pin3-Green (Techometer/Signal output)
Pin4-Blue (PWM)
Overall Specification:
Dimension: 82.6 x 81.0 x 27.8mm
Fan Dimension 75 x 75 x 15 mm
Weight: 380g ± 5g
Material: Copper Heat Sink with Skiving Fins
Alloy Frame Blower with PWM function
Plastic Push-Pin Mounting for avoiding interference with back end components
GE-Toshiba TIG830SP Thermal Grease Pre-Printed
Support CPU Power up to 73 Watts
Bearing 2 Ball Bearing
Rated Voltage 12 V
Connector: PWM 4 pin w/9" tail
CE, TUV, UL & RoHS Compliant
Prices had in October 2018 to increase due to new Section 301 tariffs.
